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Large-Area 3D Optical Surface Profilometer

Large-Area 3D Optical Surface Profilometer

Large-Area 3D Optical Surface Profilometer is a high-performance three-dimensional optical metrology system designed for large-area surface topography measurement. It combines high-speed scanning, multiple imaging technologies, and ultra-high vertical resolution to deliver accurate and repeatable 3D surface data across a wide range of sample sizes and material types. By integrating six imaging and analysis methods on a single platform, this system enables nanoscale surface characterization while maintaining excellent efficiency and measurement flexibility.

Application

The Large-Area 3D Optical Surface Profilometer is suitable for surface morphology analysis and dimensional evaluation of various materials and components, including but not limited to:

Semiconductor wafers and microelectronic devices

Thin films and optical coatings

Precision mechanical components

Functional surfaces with large slopes or low reflectivity

Transparent or multilayer materials

Micro- and nano-structured surfaces

Typical test objects include wafers, devices, thin films, coated components, and precision assemblies requiring large-area, high-resolution surface measurement.

Standards

The system’s analysis capabilities and software design support surface metrology requirements defined in relevant international standards, including but not limited to:

ISO 25178 (Surface texture: Areal)

ISO 4287 / ISO 4288 (Surface roughness parameters and evaluation)

ISO 16610 (Filtration of surface texture)

ISO standards for optical surface measurement and reporting

Parameters

Parameter Specification
Imaging speed High-speed camera up to 200 FPS
Z-axis resolution Sub-nanometer resolution, independent of objective magnification or scan range
Imaging technologies White light interferometry, confocal, spectral film thickness, bright field, dark field, zoom imaging, AFM
XY stage Modular precision XY stage, customizable up to 300 × 300 mm
Sample compatibility Wafers, devices, thin films, components, large-area samples
Software ISO-compliant analysis software with automated measurement and reporting

Features

Six-in-one integrated imaging and analysis platform

High-speed camera enabling rapid surface acquisition

Sub-nanometer vertical resolution for precise height measurement

Modular and scalable platform for large-area samples

High-resolution spinning disk confocal scanning for fast area imaging

Physical suppression of scattered light to improve image contrast and accuracy

Advanced software for automated analysis and standardized report generation

Accessories

Precision modular XY stage (up to 300 × 300 mm)

High-speed imaging camera

Confocal scanning module

White light interferometry module

Thin film thickness measurement module

AFM measurement module

Maintenance Information

Keep optical components clean to maintain measurement accuracy and image quality.

Periodically inspect the XY stage and motion system for smooth operation.

Ensure the system operates within the specified environmental conditions.

Perform routine software updates and calibration as recommended to maintain compliance with measurement standards.

FAQ

1. What makes the Large-Area 3D Optical Surface Profilometer suitable for large samples?

The system is built on a modular platform that supports a precision XY stage customizable up to 300 × 300 mm. This allows stable and accurate measurement of large-area samples such as wafers, devices, and assembled components. High-speed scanning and automated analysis further ensure that expanding the measurement area does not compromise efficiency or data consistency.

2. How does the six-in-one imaging configuration improve measurement capability?

By integrating white light interferometry, confocal imaging, spectral film thickness measurement, bright field, dark field, zoom imaging, and AFM on a single platform, the system can handle a wide range of surface types. Smooth, rough, transparent, low-reflectivity, and multilayer samples can all be measured with appropriate techniques, enabling nanoscale resolution and comprehensive surface characterization without changing instruments.

3. Why is spinning disk confocal scanning faster than traditional confocal methods?

Spinning disk confocal scanning uses multiple pinholes simultaneously, allowing full-field area scanning instead of point-by-point acquisition. This eliminates the need to move the XY stage or scanning mirrors for each point, significantly increasing measurement speed while physically blocking scattered light to reduce noise and enhance resolution, especially for transparent or steep-slope surfaces.

4. What advantages does white light interferometry provide in surface measurement?

White light interferometry offers the highest Z-axis resolution among optical surface measurement techniques. Phase-shifting scanning is suitable for smooth surfaces, while white light scanning is effective for rough surfaces. Combined with a high-speed camera delivering up to 200 PSI scanning frames, the system can generate complete 3D surface data within approximately one second.


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