Why do electronic chips use dustproof level test boxes?

Electronic chips are the core of electronic products, and all control and operation are concentrated in the chip. So why do we use a dustproof level test box for dustproof testing of smaller things? How to say that in general, chips are included in the product shell and are rarely affected by sand and dust, but it is not ruled out that certain exceptional situations, such as sand and dust invasion caused by damage to the shell, are also included, It will affect the normal operation of electronic chips, and just like a computer host box, the casing has heat dissipation holes. Therefore, every time we open the casing, we will find that the motherboard is covered in dust, which will also affect normal operation.

By using a dust level test box, various scenarios of sand and dust intrusion can be simulated. By conducting sand and dust tests on electronic chips, the design protection defects of electronic chips can be well identified.

The dustproof test of electronic chips mainly studies the impact of sand and dust particles of different particle sizes on electronic chips. The purpose of the experiment is to detect the protection of the electronic product's outer shell against internal chips and other components, and to understand the impact of dust intrusion on the chips and whether there may be short circuits or fires. Create environments with different temperatures and humidity using a dust level test chamber, and test electronic chips using different concentrations of sand and dust.

When conducting dust tests on electronic chips, dust particles of conventional size are generally used as the test source. The dust level required for electronic chips is generally IP5 or IP6, aiming to completely prevent the entry of dust, or to prevent the normal operation of chip components after dust entry. Generally, dust prevention testing for electronic chips is carried out with IP6 level protection, as excessive accumulation of sand and dust can cause damage to electronic chips. Therefore, complete dust isolation is the protection method.